Ni ukubera iki Micro-Flatness ari ngombwa mu isahani ya Aluminiyumu ishashe ya Wafer ikoresha ibishishwa bya robo?

Ibikoresho byo guhimba Semiconductor (fabs) bishingira kumashini zikoresha wafer zikoresha imashini kugirango yimure wafer ya ultra-thin, yoroshye cyane ya silicon waferi hagati ya Photolithography, etching, hamwe nibikoresho bya tekinike ya mashini (CMP). Gukorera imbere mu byumba byinshi-vacuum hamwe na ISO yo mu cyiciro cya 1 kugeza mu cyiciro cya 5 cy’isuku, ibyo bisoza-amaherezo hamwe n’amaboko ya robo yerekana ibikoresho byihuta cyane kandi byihuta hamwe na sub-micron ihagaze neza.

Micro-warping, stress yimbere yimbere, cyangwa ubuso butameze neza mububiko bwimbere bwimashini ya robo itera uburyo bwo kunyeganyega kwinshi, imivurungano yumuyaga imbere mubyumba byogusukura laminari, hamwe no gutondekanya amaherezo. Inzibacyuho Kuri micro-flat yometse kuri plaque ya aluminiyumu (ukoresheje ibinure byoroheje, bisya neza neza nka 5052-H111, 6061-T651, cyangwa 7075-T651 hamwe na anti-static cyangwa ibyingenzi birinda ibyingenzi) byemeza ko habaho ubwuzuzanye bwuzuye, kunyeganyega, no kubahiriza ubwiherero.

Imyubakire yuburyo, Impera-Imikorere ya Drift, hamwe na Wafer Kudahuza

Wafer ikoresha amaboko ya robo yimuka ibihumbi byinshi byamadorari ya silicon wafers kumuvuduko mwinshi:

Gukwirakwiza Umwanya: Inenge ntoya ya micro-flatness (~ 0.3 mm) ku kibanza cyamazu yintoki ihindurwamo milimetero nyinshi gutandukana kumwanya wanyuma wanyuma, bigatera impanuka ya wafer cyangwa impanuka ya cassette.

Amplification ya Resonant Harmonic: Igikonoshwa kitari igipfundikizo gitwikiriye munsi yumwanya utunguranye-uhagarara. Iyinyeganyeza ya parasitike ikwirakwira binyuze muri robo ya robo, bikabuza kwicara kwa wafer byoroshye.

Indege ya Aerodynamic & Isuku yo hanze

Igishishwa kitari planari kibangamira isuku yo kugenzura ibidukikije:

Urupapuro rusanzwe rw'icyuma na Micro-Flat Yometseho Isahani ya Aluminium

Isuku yo mu kirere isukuye: Micro-waviness kumaboko yimashini ya robo itera micro-vortices mumigezi ya vertical laminar itemba, ifata uduce duto two mu kirere dukikije wafer ya silicon.

Kwanduza Kwanduza: Icyuma kidatwikiriwe cyangwa cyarangiye nabi gitwikiriye umukungugu wa microscopique oxyde cyangwa umutego uzunguruka, urenze molekile kama mumyuka ya vacuum.

 Ibikoresho bya robot bya Shell

Imbonerahamwe ikurikira iragereranya ibyingenzi byingenzi byubuhanga bwibikoresho bikoreshwa muri semiconductor wafer ikoresha amazu ya robo:

Inyungu zingenzi muri Wafer Gukoresha Amashanyarazi

Ibibazo

Q1: Ni ukubera iki micro-flating ari ingenzi cyane kuri wafer ikora ibishishwa bya robo kuruta ibifuniko rusange byinganda?

Igisubizo: Wafer ikoresha amaboko igera kuri metero ebyiri kugirango ishyire wafer ya silicon hamwe na sub-micron neza neza imbere ya cassette. Micro-flatness amakosa yibibanza byamazu yaguka kuburyo bugaragara munsi yuburebure bwamaboko, bigatera amaherezo ya effektori no kwangirika kwa wafer.

Q2: Nigute 6061-T651 irinda kurwana mugihe kinini cya CNC?

Igisubizo: 6061-T651 ikorerwa kuramburwa ( 1% –3% ) nyuma yo kuvura ubushyuhe, bikagabanya imihangayiko yimbere. Iyo icyuma gikozwe kure kugirango cyorohereze igishishwa cya robo, isahani iguma iringaniye nta kunama cyangwa kugoreka.

Q3: Ni ubuhe bunini bwo gutwikira busabwa kugumana micro-tekinike kuri plaque ya aluminiyumu?

.Igisubizo ​ ​Umubyimba udahuje umwe uhindura ubuso bwa coplanarite kandi ubangamira sensor igenera imibare.

Q4: Nigute ibishishwa bya aluminiyumu bifunze byujuje ubuziranenge bwa ISO Icyiciro cya mbere?

Igisubizo . Byongeye kandi, impuzu zidakabije zirinda ibyuma guhindagurika no guhagarika imyuka ihumanya ikirere imbere mu byumba bya vacuum.

Q5: Nibihe bikoresho byo gukingira bisabwa kugirango wohereze neza plaque ya aluminiyumu?

.Igisubizo

Umwanzuro

Kugaragaza micro-flat isize aluminiyumu ya wafer ikora ibishishwa bya robo byerekana neza ko imyanya ihagaze neza, guhindagurika kunyeganyega, hamwe nubwiherero bwuzuye.

Kugirango uhindure ibikoresho byatoranijwe kuri progaramu ya robotics ya semiconductor:

Kugaragaza Stretcher-Urwego T651 Ubushyuhe: Tegeka 6061-T651 cyangwa 7075-T651 ibyapa byoroheje kugirango uhagarike umutekano murwego rwo gutunganya CNC.

Mandate Sub-Micron Flatness & Roughness Limits: Saba laser interferometer igenzura yemeza kwihanganira uburinganire muri ≤ 0.1mm / m hamwe nubuso bwa Ra ≤ 0.2μm.

Kugenzura ASTM E595 Kwuzuza Vacuum Kwirinda: Kwemeza ko impuzu zidahinduka cyangwa zikingira ibintu byujuje ubuziranenge bw’ikirere (TML <0.10%, CVCM <0.01%).